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Winslow Automation, Inc. has been advancing lead finish
and soldering technology for the military & aerospace, medical, telecommunications,
and consumer electronics industry since its inception in 1986. Winslow Automation’s
soldering solutions for electronic component solder application and repair
includes consumables as well as equipment.
Patented by Raychem, the SolderQuik® BGA Reballing
Preform is the fast, simple, cost effective solution for all low volume
ball attach and reballing needs. The SolderQuik® BGA
Reballing Starter Kit provides essential tools and supplies needed to
launch this solution on your production line, in your lab, or at remote
sites. The Model 237 Solder Pot complements the
kit for your de-balling needs.
Winslow Automation also offers legacy products in our SolderQuik® consumables
line to meet your component ruggedization and fine pitch to PCB rework needs
with SolderQuik® Chip Carrier Mounting Device (CCMD)
and SolderQuik® Tape respectively.
Winslow Automation’s soldering equipment line features the
FlexLine™ Robotic Hot Solder Dip Module for those
needing the capability of processing a large volume and variety of multiple
components through a repeatable and robotic hot solder dip process. It is
complemented by our Fine Pitch Lead Tinning Flux
which is formulated to prevent icicles and bridging between leads when soldering
fine pitch components.
With a diverse product selection and
services, we continue to lead
the way in providing superior BGA reballing solutions and other microelectronic
soldering technologies.
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Featured Product
BGA Reballing Solutions
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Delivery Status:
1-2 Days for Online Orders under 100 pieces. |
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News
February 4, 2008
Winslow Automation's New Website Released
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