BGA Reballing and Robotic Hot Solder Dip Solutions



 

 

SolderQuik® Flux 66.001
(Lead Tinning Flux)

 
 

Winslow Automation developed this fine pitch lead tinning flux (66.001) specifically to improve the quality of soldering fine pitch component leads. This organic acid flux is halide free to reduce risks to component reliability.

Improved Wetting Power

Winslow Automation formulated this flux to provide additional wetting power and to prevent surface tension soldering defects such as icicles and bridging. The flux is designed for use with ceramic as well as plastic packages and can be applied by wave fluxing, dipping or spraying.

Water-Soluble

Used in hot solder dip processes, Winslow Automation’s flux ensures solderability and the formation of a strong intermetallic bonds between the solder and the base metal. The flux is 100% soluble in hot de-ionized water which should be used to remove all residues from components.

 



MATERIAL SAFETY DATA SHEET

 

Physical Properties

Specific Gravity: (75°F/24°C) 1.154
Pounds per Gallon: 8.6
Halide Content: None
pH (10% Solution): 4.0±0.3
Flash Point (TOC): 71°F/22°C
Auto Ignition Temperature: 775°F/413°C
Appearance: Clear Amber