SolderQuik® BGA Reballing Preforms
	"Winslow Automation's patented  SolderQuik® BGA Reballing Solder Preform is the solution to all of your ball attach and reballing needs."
	Product Overview Originally developed by Raychem Corporation in 1994, the SolderQuik® Solder Preform is THE low volume ball attach solution. It is an excellent, fast, and low cost technique for BGA reballing in volumes ranging from a few to several thousand. The wide variety of available patterns makes the SolderQuik® Solder Preform an attractive and flexible solution for most all BGA reballing requirements.  Typical applications include prototyping, small volume runs, and reballing/rework of BGA components.
	What is the SolderQuik® BGA Preform? The patented SolderQuik® BGA Reballing Preform consists of an array of solder spheres embedded in a water soluble carrier. The preforms can be made in almost any possible array pattern, including various pitches and ball diameters. SolderQuik® BGA Reballing Preforms will accurately place a new array of solder spheres relying on simple physical properties rather than operator skill. Winslow places the solder spheres within a 0.0004" tolerance in the carrier material. The preform process relies on edge registration with the package to align the array on the package, and the self-centering characteristics of eutectic solder perfectly centers the solder balls to the pads during reflow.
	What are the benefits to using the SolderQuik® Solder Preform? Fast Delivery is typically within 1-2 business days for orders under 200 preforms. Easy Learning the process takes a short time and no special training is required. Flexibility Small volume ball attach methods using stencils generally require you to have a different stencil for all of your different array patterns, which gets very expensive. Winslow Automation currently has a growing database of "standard" array patterns, with new ones being added all the time. We use very flexible tooling to make our preforms. So, even if we don't currently have the pattern you need, if you send us a drawing we can make nearly any pattern for a small programming charge. Adaptability The SolderQuik® BGA Reballing Preforms are designed to work well with the equipment and tools you already have. You can use them with almost any reflow system you have, and they work well alongside most rework stations used for component removal and preparation. Better Throughput Means Lower Labor Costs Using stencil methods with either loose solder spheres or solder paste, you can typically only process one component at a time. Using SolderQuik® BGA Reballing Preforms, you can process many parts at the same time with only a few minutes of extra labor. And, using preforms, those parts could all, just as easily, have different pitches, array patterns, and ball diameters. Proven Technology Originally developed by Raychem Corporation in 1994, the Solderquik Preform received the SMT Product of the Year Award in 1998.  Since then, its' reliability, flexibility, and ease of use are unmatched and will continue for many years.
	SolderQuik® BGA Reballing Preform Technical Specifications Ball Dia. Acceptable Pitch Min. Offset Solder Alloy Body Size (Range) mm in. 1.27 mm 1.00 mm 0.80 mm 0.65 mm 0.50 mm mm Pb Free Pb mm 0.762 0.030 0.90 Sn96.5-Ag3-Cu0.5* Sn63-Pb37 4 x 4 to 55 x 55 0.635 0.025 0.90 0.610 0.024 0.80 0.559 0.022 0.80 0.508 0.020 0.75 0.457 0.018 0.75 0.381 0.015 0.65 * Our Pb Free composition is known as SAC305
	Reflow Process Ensure all parts are cleaned and baked before reflow 1) Insert Preform 2) Check Alignment 3) Apply Paste Flux 4) Insert BGA 5) Reflow 6) Moisten & Remove Paper
	Additional Links Find your Preforms Here! SolderQuik® BGA Reballing Quick Guide (PDF) Frequently Asked Questions Material Safety Data Sheet (Domestic) (PDF) Material Safety Data Sheet (International) (PDF) Request for Quote Form SolderQuik® BGA Reballing Instruction Manual (PDF) SolderQuik® BGA Reballing Demo Application Notes Shelf Life of BGA Preforms (PDF) Application Note; Lead Free Alloys in BGA Preforms (PDF)