What are the benefits to using the SolderQuik® BGA Preform?
Delivery is typically within 1-2 business days for orders under 200 preforms.
Learning to use the preform takes less than 10 minutes. Simply flux, apply, and reflow!
Small volume ball attach methods using stencils generally require you to have a different stencil for all of your different array patterns, which gets very expensive.
Winslow Automation currently has a growing database of "standard" array patterns, with new ones being added all the time. We use very flexible tooling to make our preforms. Even if we don't currently have the pattern you need, for a small programming charge we can make nearly any pattern from your drawing .
The SolderQuik® BGA Reballing Preforms are designed to work well with the equipment and tools you already have. You can use them with almost any reflow system (convection oven or reflow oven), and they work well alongside most rework stations used for component removal and preparation.
Better Throughput Means Lower Labor Costs
Using stencil methods with either loose solder spheres or solder paste, you can typically process only one component at a time.
Using SolderQuik® BGA Reballing Preforms, you can process many parts at the same time with only a few minutes of extra labor. Using preforms, those parts could all just as easily have different pitches, array patterns, and ball diameters.
Originally developed by Raychem Corporation in 1994, the Solderquik Preform received the SMT Product of the Year Award in 1998. Since then, its low cost, quick turn, east of use & reliability are unmatched.