Lead-Free Solder Alloys in SolderQuik^® BGA Preforms

Winslow Automation’s SolderQuik^® BGA Reballing Preforms are available in a Lead Free version that utilizes spheres composed of SAC305 (Sn96.5/Ag3.5/Cu0.5) alloy. The highlighted S, A, and C are the root of the popular SAC acronym. This alloy complies with the J-STD-006 requirements.

The selection of this alloy as Winslow Automation’s choice for inclusion in this product line was driven by two factors: the vast majority of our lead-free customers requested this alloy and it is currently the most popular lead-free alloy used by semiconductor manufacturers.

We receive many requests for lead free alloy spheres that are similar to but not an exact match with the SAC305 (Sn96.5/Ag3.0/Cu0.5) alloy that we stock.

Winslow Automation is committed to complying with customer call-outs whenever possible. Due to minimum buy quantities and shelf life issues it is not possible for us to stock every alloy offering. We recommend that applications of this nature be reviewed for compatibility with common, popular alloys whenever possible.

As always, Winslow Automation, Inc. will quote the use of custom alloys in its products with the stipulation that additional charges may be incurred and lead times can increase. It is our policy that orders involving custom alloys cannot be canceled.