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Winslow Automation’s Model 237 is a simple, compact, stand-alone wave
solder pot that can be used for a wide variety of hand solder-dipping needs.
It is ideal for lead tinning small components and for short production runs.
Table-Top Adaptability
The dynamic pumped wave provides a clean, dross-free 4" dipping area and
eliminates the need to skim the solder surface. All wetted parts are constructed
of titanium that will withstand higher continuous temperatures than stainless
steel or coated tanks making it the clear choice when using high temperature
and No-Lead alloys.
Versatile for High Temperature Applications
Digital temperature control, accurate to ± 1°
C, consistently maintains solder temperatures up to 426°
C and gives you the flexibility to use Model 237 for other applications such
as high-temperature wire stripping. The interchangeable nozzle allows for a
variety of configurations and permits easy cleaning.
Features:
- Bench top dynamic (wave type) solder pot for a variety of manual
solder dipping applications.
- Provides a continuous oxide free surface (no skimming required) with
adjustable flow rate.
- Construction is stainless steel, powder coated steel, and titanium for
all wetted parts.
- Standard nozzle size is 4 inches diameter with well depth is 3 inches.
- P.I.D., Auto-tuning digital temperature controller with accuracy of
±1°C.
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Specifications
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Solder Capacity: |
40 lbs. |
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Process Temp.: |
800°F/426°C |
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Power Req.: |
208/240 VAC, 8.5A, 60 HZ |
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Heaters: |
(2) 1000 W 3/4" Dia Cartridge |
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Nozzle: |
4" diameter |
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O.A.L. - L x W x D: |
23" x 12" x 13" |
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Shipping Weight: |
35 lbs. |
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Average Heat Up Time:
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1/2 hour |
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