BGA Reballing and Robotic Hot Solder Dip Solutions



 

AS9100C and ISO 9001:2008 Certified

 

Wave Solder Pot
(Model 237)

 
 

Winslow Automation’s Model 237 is a simple, compact, stand-alone wave solder pot that can be used for a wide variety of hand solder-dipping needs. It is ideal for lead tinning small components and for short production runs.

Table-Top Adaptability

The dynamic pumped wave provides a clean, dross-free 4" dipping area and eliminates the need to skim the solder surface. All wetted parts are constructed of titanium that will withstand higher continuous temperatures than stainless steel or coated tanks, making it the clear choice when using high temperature and Pb-Free alloys.

Versatile for High Temperature Applications

Digital temperature control, accurate to ± 1° C, consistently maintains solder temperatures up to 426° C, and gives you the flexibility to use Model 237 for other applications such as high-temperature wire stripping. The interchangeable nozzle allows for a variety of configurations and permits easy cleaning.

Features:

  • Bench top dynamic (wave type) solder pot for a variety of manual solder-dipping applications
  • Provides a continuous oxide-free surface (no skimming required) with adjustable flow rate
  • Construction is stainless steel, powder coated steel, and titanium for all wetted parts
  • Standard nozzle size is 4 inches diameter, well depth is 3 inches.
  • P.I.D., Auto-tuning digital temperature controller with accuracy of ±1°C.
 

 

Specifications

Solder Capacity: 40 lbs.
Process Temp.:

800°F/426°C

Power Req.:

208/240 VAC, 8.5A, 60 Hz

Heaters: (2) 1000 W 3/4" Dia Cartridge
Nozzle: 4" diameter
O.A.L. - L x W x D: 23" x 12" x 13"
Shipping Weight: 35 lbs.

Average Heat Up Time:

1/2 hour
 
 

 

Important Information about Discontinued Products