BGA Reballing and Robotic Hot Solder Dip Solutions



 

 

SolderQuik®
Tape

 
 

Broad Range of Use

SolderQuik® Tape combines a preform of solder on a strip of adhesive-backed plastic film that is precut to fit between adjacent component leads, and divides the melting solder. The correct amount of solder flow is assured to each joint without bridging. As a result, SolderQuik® is ideal for both original assembly and for your prototype and rework needs.

Fax Back Form
Material Safety Data Sheet

 
 

tapedwg2.jpg (5830 bytes)

 
   

* Due to the large amount of set-up time involved with manufacturing this product, there is a $100,000 minimum order required.